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thermal pad

HIGH Thermal Conductive Silicone PAD

High thermal performance
Flat Sheets
Most Economical

DESCRIPTION

USTP180G Thermal Conductive Silicone Rubber is used to fill air gaps between components or PC boards and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing use in areas where space is limited.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improving the thermal conductivity function between the component and the metal thermal spreader.
To provide insulation between the component and the heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improving the thermal conductivity function between the component and the metal thermal spreader.
To provide insulation between the component and the heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.