USTP160YS
thermal pad
thermal pad
高熱性能
平面板
最具經濟性
描述
USTP160YS 熱導矽橡膠用於填充部件或 PC 板與散熱片、金屬外殼及底盤之間的空氣間隙。這些先進材料的卓越適應性使其能夠覆蓋高度不均勻的表面,將熱量從單個組件或整個板轉移,並且在空間受限的情況下進行操作。
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.