The thermally conductive material of USTP160 is designed for a wide variety of applications requiring high thermal conduction and electrical insulation. These applications also typically have lower mounting pressures for component clamping.

USTP160 possess material combines a smooth and highly pliable surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Typical Properties

Typical Applications Include

• Power supplies       

• Motor controls

• Power semiconductors

• Automotive electronics

Configurations Available

Sheet form, die-cut parts, and roll form
(with or without pressure sensitive adhesive)