Product Description

The USTP series product is a type of polyurethane thermal conductive interface filler. Due to its soft texture and sticky surface, it can reduce the load during the IC chip compression process. The USTP series product is a high-performance silicone-free thermal conductive gasket with high thermal conductivity and a soft interface.

• Good softness and conformability to non-flat surfaces

• Excellent compressive stress relaxation

• High thermal conductivity

• Complete UL94 V-0

• Good surface tack leads to low thermal resistance at the surface

• Non-silicone polyurethane elastomer

• Good dielectric performance

• Excellent durability for long-term thermal conductivity and electric insulation stability