USTP-188A
thermal pad
thermal pad








The USTP188A thermal silicone pad, with its extremely high thermal conductivity 6.0 W/m·K, is the latest heat conductive material developed by Unistart Technology Company to meet customer demands.
It effectively fills micro-gaps among structures when used on high-temperature components, thus greatly improving each one’s performance.
Product Application
Electronic parts: IC, CPU, MOS.
LED, M/B, PS, Heat Sink, LCD-TV, NB, PC, and so on.
DDRII Module, DVD Application, and so on.
Product Application
Electronic parts: IC, CPU, MOS.
LED, M/B, PS, Heat Sink, LCD-TV, NB, PC, and so on.
DDRII Module, DVD Application, and so on.
Product Application
Electronic parts: IC, CPU, MOS.
LED, M/B, PS, Heat Sink, LCD-TV, NB, PC, and so on.
DDRII Module, DVD Application, and so on.
Product Application
Electronic parts: IC, CPU, MOS.
LED, M/B, PS, Heat Sink, LCD-TV, NB, PC, and so on.
DDRII Module, DVD Application, and so on.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.
Quickly fill out your requirements to create a customized product specification.
Select the required specifications, and we will provide professional advice and quotations.




