USTP-160GF

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thermal pad

High thermal performance
Flat Sheets
Most Economical

DESCRIPTION

USTP160GF Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Boards and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing for use in restricted spaces.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improve the thermal conductivity function of both components and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improve the thermal conductivity function of both components and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improve the thermal conductivity function of both components and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.

APPLICATIONS

TYPICAL PROPERTIES

By applying these materials to fill the gap between the heating element and the thermal spreader, we can obtain the following effects:

Improve the thermal conductivity function of both components and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of the heating component to the chassis or heat sinks.