Normark thermally conductive adhesive tapes are ideal thermal interface materials that are specially developed for heat sink attachment to MPU, chip set, DDR, and other plastic encapsulated components with excellent thermal conductivity, cushioning, and gap-filling properties.

It consists of an aluminum/fiberglass foil backing and is coated on both sides with a very high temperature-resistant acrylic adhesive. Because of its high heat stability, this tape can also be used to attach components to vertical heat sinks and metal enclosure surfaces.