USTP188CN

產品與解決方案

關於我們

最新消息

常見問題

Select Language

聯絡我們

智慧零售

Smart Retail

網通統籌

Network Integration

電子材料

Electronic Materials

Select Language

High thermal conductivity materials

Product Description

USTP188CN Thermally Conductive Pads are used to fill air gaps between components or PC
Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.

Applications

Optical Electronics	Communications	Computer Hardware	Consumer Electronics
LED Lighting	Cellular Phone	Notebook	Memory Modules
Monitor	Wireless Products	Desktop	DVD Application
Touch Panel	Telecom Devices	Optical Disk Drives	Set-Top Box
Heat Sink		Power Supply	Digital Imaging Equipment

Notice

The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.

Applications

Optical Electronics	Communications	Computer Hardware	Consumer Electronics
LED Lighting	Cellular Phone	Notebook	Memory Modules
Monitor	Wireless Products	Desktop	DVD Application
Touch Panel	Telecom Devices	Optical Disk Drives	Set-Top Box
Heat Sink		Power Supply	Digital Imaging Equipment

Notice

The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.

Applications

Optical Electronics	Communications	Computer Hardware	Consumer Electronics
LED Lighting	Cellular Phone	Notebook	Memory Modules
Monitor	Wireless Products	Desktop	DVD Application
Touch Panel	Telecom Devices	Optical Disk Drives	Set-Top Box
Heat Sink		Power Supply	Digital Imaging Equipment

Notice

The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.

Applications

Optical Electronics	Communications	Computer Hardware	Consumer Electronics
LED Lighting	Cellular Phone	Notebook	Memory Modules
Monitor	Wireless Products	Desktop	DVD Application
Touch Panel	Telecom Devices	Optical Disk Drives	Set-Top Box
Heat Sink		Power Supply	Digital Imaging Equipment

Notice

The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.