USTP188-280
High thermal conductivity materials
High thermal conductivity materials
Product Description
USTP188-280 Thermally Conductive Pads are used to fill air gaps between components or PC
Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
Typical Properties
Applications
Optical Electronics
LED Lighting
Monitor
Touch Panel
Heat Sink
Communications
Cellular Phone
Wireless Products
Telecom Devices
Computer Hardware
Notebook
Desktop
Optical Disk Drives
Power Supply
Consumer Electronics
Memory Modules
DVD Application
Set-Top Box
Digital Imaging Equipment
Notice
The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.
Typical Properties
Applications
Optical Electronics
LED Lighting
Monitor
Touch Panel
Heat Sink
Communications
Cellular Phone
Wireless Products
Telecom Devices
Computer Hardware
Notebook
Desktop
Optical Disk Drives
Power Supply
Consumer Electronics
Memory Modules
DVD Application
Set-Top Box
Digital Imaging Equipment
Notice
The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.
Typical Properties
Applications
Optical Electronics
LED Lighting
Monitor
Touch Panel
Heat Sink
Communications
Cellular Phone
Wireless Products
Telecom Devices
Computer Hardware
Notebook
Desktop
Optical Disk Drives
Power Supply
Consumer Electronics
Memory Modules
DVD Application
Set-Top Box
Digital Imaging Equipment
Notice
The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.
Typical Properties
Applications
Optical Electronics
LED Lighting
Monitor
Touch Panel
Heat Sink
Communications
Cellular Phone
Wireless Products
Telecom Devices
Computer Hardware
Notebook
Desktop
Optical Disk Drives
Power Supply
Consumer Electronics
Memory Modules
DVD Application
Set-Top Box
Digital Imaging Equipment
Notice
The shelf life of the thermal pad without adhesive is 12 months from the date of manufacture when stored at temperature (25±5°C) & humidity (60±10%RH).
The technical information is established by UniStart test equipment and test method, but the accuracy or completeness of such information is not guaranteed. Before using the product, you must evaluate it and determine if it is suitable for your intended application.
All silicone products might have potential risk of oil bleeding in some distinct applications. Contact UniStart representative for recommended product.
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