USTP180A/B
導熱墊
導熱墊
Characteristics
Thermal Conductivity：2.15~2.5 W/m
High thermal conductive
Cost effective solution
Electrical insulation
General-purpose thermal interface material solution
Flame retardant
USTP180A/B 是一兼具高導熱與絕緣的材料，材料中採用的聚合物使其材料具有彈性，可以容易的使用、操作在機件不平整的表面上。USTP180A/B 的以上特性為機構間組裝、運用最理想的材料。
Typical Application Include
Graphics card/processor
Multiple heat-generating components to a common heat sink
Wireline/Wireless communications hardware
Configurations Available
Sheet form, die-cut parts
(with or without pressure sensitive adhesive)
USTP180A/B 是一兼具高導熱與絕緣的材料，材料中採用的聚合物使其材料具有彈性，可以容易的使用、操作在機件不平整的表面上。USTP180A/B 的以上特性為機構間組裝、運用最理想的材料。
Typical Application Include
Graphics card/processor
Multiple heat-generating components to a common heat sink
Wireline/Wireless communications hardware
Configurations Available
Sheet form, die-cut parts
(with or without pressure sensitive adhesive)
USTP180A/B 是一兼具高導熱與絕緣的材料，材料中採用的聚合物使其材料具有彈性，可以容易的使用、操作在機件不平整的表面上。USTP180A/B 的以上特性為機構間組裝、運用最理想的材料。
Typical Application Include
Graphics card/processor
Multiple heat-generating components to a common heat sink
Wireline/Wireless communications hardware
Configurations Available
Sheet form, die-cut parts
(with or without pressure sensitive adhesive)
USTP180A/B 是一兼具高導熱與絕緣的材料，材料中採用的聚合物使其材料具有彈性，可以容易的使用、操作在機件不平整的表面上。USTP180A/B 的以上特性為機構間組裝、運用最理想的材料。
Typical Application Include
Graphics card/processor
Multiple heat-generating components to a common heat sink
Wireline/Wireless communications hardware
Configurations Available
Sheet form, die-cut parts
(with or without pressure sensitive adhesive)
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