USTP180A/B 是一兼具高導熱與絕緣的材料，材料中採用的聚合物使其材料具有彈性，可以容易的使用、操作在機件不平整的表面上。USTP180A/B 的以上特性為機構間組裝、運用最理想的材料。

Typical Application Include

• Graphics card/processor

• Multiple heat-generating components to a common heat sink

• Wireline/Wireless communications hardware

Configurations Available

Sheet form, die-cut parts
(with or without pressure sensitive adhesive)