USTP-160YS
導熱墊
導熱墊








High thermal performance
Flat Sheets
Most Economical
DESCRIPTION
USTP160YS Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
APPLICATIONS

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the thermal conductivity function between component and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of heating component to chassis or heat sinks.

APPLICATIONS

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the thermal conductivity function between component and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of heating component to chassis or heat sinks.

APPLICATIONS

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the thermal conductivity function between component and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of heating component to chassis or heat sinks.

APPLICATIONS

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the thermal conductivity function between component and the metal thermal spreader.
To obtain insulation between the component and heat sink or chassis.
To transfer the thermal source of heating component to chassis or heat sinks.





