USTP-1800C
導熱墊
導熱墊








USTP1800C Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis.
The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
USTP1800C Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis.
The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
USTP1800C Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis.
The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
USTP1800C Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis.
The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.




