USTP-160GF
導熱墊
導熱墊
High thermal performance
Flat Sheets
Most Economical
DESCRIPTION
USTP160GF Thermal Conductive Silicone Rubbers are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.
APPLICATIONS

TYPICAL PROPERTIES

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the trermal conductivity function ootwoc~ componont and tho motal thormal sorcadcr.
To ootain insulation between the comoonent and heat sink or chassis.
To transfer the thermal source o‘ heating component to chassis o’ heat snks.

APPLICATIONS

TYPICAL PROPERTIES

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the trermal conductivity function ootwoc~ componont and tho motal thormal sorcadcr.
To ootain insulation between the comoonent and heat sink or chassis.
To transfer the thermal source o‘ heating component to chassis o’ heat snks.

APPLICATIONS

TYPICAL PROPERTIES

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the trermal conductivity function ootwoc~ componont and tho motal thormal sorcadcr.
To ootain insulation between the comoonent and heat sink or chassis.
To transfer the thermal source o‘ heating component to chassis o’ heat snks.

APPLICATIONS

TYPICAL PROPERTIES

By applying this materials to fill gap between heating element and thermal spreader, we can obtain the following effects:
Improve the trermal conductivity function ootwoc~ componont and tho motal thormal sorcadcr.
To ootain insulation between the comoonent and heat sink or chassis.
To transfer the thermal source o‘ heating component to chassis o’ heat snks.
