USSF700A
非矽導熱墊
非矽導熱墊
USSF700A is silicone-free thermal interface materials which are suitable for the cooling of components which may be effected by silicone outgassing such as optical devices, automotive electronics or military hard wear .
Features
Thermal conductivity: 1.5 W/m*K
It’s maked by non-silicone resin materials
Low contact thermal resistance
With electrical insulation
Outstanding thermal conductivity
Qualified for UL94V-0
Applicable to optical and sensitive electric components
Typical Applications
HDDS
Optical appliance
Specifications
Sheet form
Die-cut parts
Features
Thermal conductivity: 1.5 W/m*K
It’s maked by non-silicone resin materials
Low contact thermal resistance
With electrical insulation
Outstanding thermal conductivity
Qualified for UL94V-0
Applicable to optical and sensitive electric components
Typical Applications
HDDS
Optical appliance
Specifications
Sheet form
Die-cut parts
Features
Thermal conductivity: 1.5 W/m*K
It’s maked by non-silicone resin materials
Low contact thermal resistance
With electrical insulation
Outstanding thermal conductivity
Qualified for UL94V-0
Applicable to optical and sensitive electric components
Typical Applications
HDDS
Optical appliance
Specifications
Sheet form
Die-cut parts
Features
Thermal conductivity: 1.5 W/m*K
It’s maked by non-silicone resin materials
Low contact thermal resistance
With electrical insulation
Outstanding thermal conductivity
Qualified for UL94V-0
Applicable to optical and sensitive electric components
Typical Applications
HDDS
Optical appliance
Specifications
Sheet form
Die-cut parts
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